What is the Fiscal Year for II-VI China?

Headquarters

Saxonburg, Pennsylvania, United States

Industry

Semiconductors

Stock Symbol

IIVI

Website

Description

II-VI Incorporated, headquartered in Saxonburg, Pennsylvania, is a global leader in engineered materials and optoelectronic components. II-VI Incorporated is a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, life sciences, semiconductor equipment, and consumer markets. II-VI Photonic Solutions is a business segment of II-VI Incorporated. II-VI Photonic Solutions' headquarters are located in Fuzhou, China, with more than 13,000 employees worldwide. II-VI Photonic Solutions is a vertically integrated manufacturing company that develops innovative products for diversified applications in the optical communications, industrials, life sciences, consumer electronics and automotive markets. II-VI Photonic Solutions delivers world-class optical products for telecom, industrial and life science market. II-VI Photonic Solutions also designs and manufactures compact, highly reliable green laser and high power lasers, along with application-orientated optics and electronics. II-VI Photonics has a global manufacturing footprint, including more than 50,000 square meters manufacturing facilities in Fuzhou, Shenzhen, Shanghai, Thailand and US, equipped with best-class machines. II-VI Photonics is certified ISO 9001, TL 9000 and ISO 14001. We keep updating our comprehensive quality management system that features manufacturing quality best practices such as 5M, 5S and 8D. Technology Innovation Worldwide R&D CENTER IN FUZHOU —Mirco-optics, Coating technics, Optical materials processing, Advanced component development PHOTONICS INTEGRATION CENTER IN SHANGHAI —Optical telecom modules, Industrial lasers, Software/Firmware/Hardware TECHNOLOGY CENTER IN SILICON VALLEY —Amplification technology, WSS modules, Line cards & subsystem CHIP INNOVATION CENTER IN EUROPE --Pump laser, Chip innovation